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Amtech Systems High Temperature Belt Furnace
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Amtech Systems, Inc. (NASDAQ: ASYS), a manufacturer of capital equipment, including thermal processing and wafer polishing, and related consumables used in fabricating semiconductor devices, such as silicon carbide (SiC).

And silicon power devices, analog and discrete devices, electronic assemblies and light-emitting diodes (LEDs), the receipt of an order for 20 controlled atmosphere furnaces for production of Direct Bond Copper (DBC) substrates.

The repeat order was received by Amtech division, BTU International, for 20 controlled atmosphere furnaces for delivery starting in the second half of fiscal 2023. These continuous furnaces will be used for the volume production of DBC substrates, a process which requires extreme control of thermal uniformity and oxidation atmosphere.

The furnaces will be produced at BTU’s factory in the USA and shipped to customer locations in Asia. The DBC substrates produced by these furnaces will be used for power device modules intended for electric vehicles (EV).

“We are seeing customer demand related to the scale-up of electric vehicles across all of our divisions,” said Michael Whang, CEO of Amtech Systems. “DBC is a technology uniquely suited for heat dissipation in power modules -- and BTU’s systems have the superior process control to produce DBC substrates reliably and at scale,” added Whang.

About Amtech Systems, Inc.

Company Name: Amtech Systems, Inc.
About Company: Amtech Systems, Inc. is a leading, global manufacturer of capital equipment, including thermal processing and wafer polishing, and related consumables used in fabricating semiconductor devices, such as silicon carbide (SiC) and silicon power devices, analog and discrete devices, electronic assemblies and light-emitting diodes (LEDs). We sell these products to semiconductor device and module manufacturers worldwide, particularly in Asia, North America and Europe. Our strategic focus is on semiconductor growth opportunities in power electronics, sensors and analog devices leveraging our strength in our core competencies in thermal and substrate processing. We are a market leader in the high-end power chip market (SiC substrates, 300mm horizontal thermal reactor, and electronic assemblies used in power, RF, and other advanced applications), developing and supplying essential equipment and consumables used in the semiconductor industry.