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1.
Telechips Unveils the 'A2X' Automotive AI Accelerator, Featuring a 200TOPS NPU for Enhanced AI Processing Performanc
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(News)
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Telechips a leading fabless semiconductor company, has unveiled its game-changing automotive AI accelerator, A2X (TCA2000/TCA1000), setting a new benchmark for the future of mobility (SDV). With its cutting-edge ...
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2.
Arbe Chipset enables HiRain's LRR610 4D Imaging Radar Systems for mass production by end of 202
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(Press Releases)
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... equipped with LRR610 Imaging Radars, powered by the Arbe chipset. This development initiative is designed to optimize the fusion and perception system, which enables key automotive safety and comfort features. ...
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Continental Reaches Milestone of 200 Million Radar Sensors to Enhance Safety and Enable the Mobility of Tomorrow
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(News)
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... “Smart radar sensors, for example, are already equipped with powerful microchips, which directly process the signals received from the sensor and – usually in combination with data from other sensor systems ...
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To optimize the product design process, OPmobility adopts PLM from Siemens Xcelerator
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(Press Releases)
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... to optimize their design, engineering and manufacturing processes to turn today's ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. ...
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5.
Trimble collaborates with STMicroelectronics to deliver a precise positioning solution for the automotive and IoT industries
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(Press Releases)
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... ProPoint® Go, will be paired with the STMicroelectronics' new groundbreaking Teseo VI GNSS chipsets delivering OEMs an integrated approach that maximizes performance and cost-efficiency while reducing ...
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6.
LG Innotek to Foster the Automotive Car Sensing Business into a USD 1.4 Billion Business by 2030, Led by Its RGB-IR In-Cabin camera module
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(Press Releases)
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... applied the "wedge bonding" process to minimize the size of the product. Wedge bonding is a technology that uses ultrasonic energy to attach chips and substrates. In the past, the chips used in the module ...
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7.
IATW 2024: The 8th Shanghai International Automotive Innovation Technology Week Concludes Successfully
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(News)
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... as well as interior and exterior design and manufacturing. Additionally, the showcase featured chassis and body systems, driving systems, chips, intelligent connectivity, autonomous driving technologies, ...
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8.
Transitioning from FPGA to ASIC for your AI chip? Here's essential information you should be aware o
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(Articles)
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... However, the software team will push you to optimize the FPGA design for performance. That means bending the architecture to fit the strengths and limitations of the chosen FPGA chips. You can count on ...
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ID Quantique's range of Quantum Random Number Generato
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(Press Releases)
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International Cryptographic Module conference (ICMC23), ID Quantique (IDQ) announced that its Quantis QRNG chips have just received NIST ESV certification on the Independent and Identically Distributed ...
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10.
Altos Radar raises $3.5m to accelerate the development and commercialization of 4D imaging radars
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(News)
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... per frame at 10 fps. Furthermore, Altos Radar's team has achieved state-of-the-art performance on low-cost, mass-produced automotive System on Chips (SOCs). This makes Altos V1 radar the world's first ...
